The Logitech Quartz Bonding Wax, 454 g / 1 lb Pack (0CON-200) is a thermoplastic mounting wax for temporarily bonding semiconductor wafers, optical components, quartz materials and delicate samples. It provides stable sample mounting during slicing, dicing, grinding, lapping and polishing, with a verified melting temperature of 68-72°C.
Key Features
- Temporary thermoplastic bonding, supporting the secure mounting and subsequent release of wafers and precision samples
- Supplied in a 454 g (1 lb) pack, providing the specified quantity for laboratory and production workflows
- Controlled melting range of 68-72°C, providing a defined thermal window for wax preparation
- Recommended bonding temperature of 75-85°C, supporting controlled application to the mounting substrate
- Insoluble in water at 25°C, as specified in Logitech's technical data
- Suitable for semiconductor and optical materials, including semiconductor wafers, optical components, quartz and delicate samples
- Supports multiple preparation stages, including slicing, dicing, grinding, lapping and polishing
- Controlled thermal release, enabling efficient de-bonding after sample processing
- Compatible with different bonding methods, from hotplate and finger-pressure mounting to controlled high-precision wafer bonding
- Applied to a heated glass substrate, with the sample positioned on the melted wax and cooled before processing
- Up to three years of shelf life after shipment, when handled and stored according to Logitech guidance
Note: Logitech specifies Ecoclear non-solvent cleaning fluid (0CON-178) for de-bonding Quartz Wax from mounted samples.
Benefits
- Helps keep samples stable and flat during precision material-removal processes.
- Reduces sample movement and the risk of edge damage during machining and preparation.
- Supports several workflow stages with one general-purpose temporary bonding wax.
- Provides defined melting and bonding temperature ranges for more repeatable process setup.
- Accommodates low-, semi- and high-precision bonding approaches as application requirements change.
Why Choose the Logitech Quartz Bonding Wax, 454 g / 1 lb Pack (0CON-200)?
The Logitech 0CON-200 combines temporary sample mounting with controlled thermal application and release for semiconductor, optical and precision materials preparation. Its 454 g pack and suitability for multiple bonding methods make it a practical consumable for both routine and high-precision workflows. Buy through John Morris Group for product supply and assistance across Australia.
