The Logitech High-Speed Lapping and Polishing Machine with Vacuum Carrier Upgrade (1CM43-S-3111) is designed for processing hard materials including diamond, gallium nitride, sapphire and silicon carbide in research and production laboratories. It combines 400 mm lapping and polishing plates, capacity for substrates and wafers up to 100 mm, and real-time process monitoring.
Key Features
- Processing for demanding hard materials, including diamond, gallium nitride, sapphire and silicon carbide
- Vacuum carrier upgrade configuration, supplied as the specified carrier arrangement for this machine
- Large 400 mm lapping plate, providing a substantial workstation for precision material preparation
- Full-wafer capacity up to 100 mm, supporting substrates, part wafers and full wafers
- Chemically resistant high-speed system, designed for laboratory lapping and polishing processes
- Compatible with Logitech Precision Lapping Jigs, allowing different samples and wafer formats to be processed
- Dedicated 400 mm polishing plate, designed for use with Logitech polishing pads
- High carrier download capability, helping increase polishing rates when processing harder materials
- Adjustable head back pressure, allowing the operator to influence and manage sample shape
- Advanced in-situ process monitoring, providing real-time information on process conditions and stability
- Coefficient-of-friction and temperature sensing, monitoring the pad, slurry, plate and carrier/pad interface
- Touch-panel control with LabVIEW 10, with USB data export to third-party statistical or analytical software
Note: For optimum processing results, the machine is designed to operate with a suitable Logitech Precision Lapping Jig and application-specific polishing pads.
Benefits
- Supports both research and production workflows involving difficult-to-process hard materials.
- Provides real-time process information so operators can evaluate stability and identify changing process conditions.
- Helps improve polishing productivity through high carrier downloads for harder sample materials.
- Allows greater control over sample shape by adjusting the carrier-head back pressure.
- Reduces changeover effort through quick plate changes and a choice of polishing pad options.
- Enables further process analysis by exporting sensor and subsystem data through the USB connection.
Why Choose the Logitech High-Speed Lapping and Polishing Machine with Vacuum Carrier Upgrade (1CM43-S-3111)?
This Logitech system combines high-speed material preparation, flexible jig and pad configurations, and continuous analytical monitoring in one platform. John Morris Group can assist with machine selection, compatible jigs, polishing pads and process accessories for the intended material and workflow.
