The Logitech EP2 Plain Polyurethane Polishing Pad, 16 in (0CON-483) is a porous expanded polyurethane pad manufactured for chemical mechanical polishing of hard materials. This single 16 in (400 mm) EP2-P pad has a 1.3 mm thickness and pressure-sensitive adhesive backing for secure attachment to a suitable polishing plate.
Key Features
- 16 in (400 mm) pad diameter, providing the specified dimensions for this EP2-P variant
- Plain, non-grooved surface, designed for polishing surfaces smaller than 20 cm²
- Micro-cellular EP2 construction, producing a sponge-like response while maintaining hardness and flatness
- 1.3 mm pad thickness, equivalent to approximately 0.050 in
- Pressure-sensitive adhesive backing, enabling stable attachment to a clean, smooth and flat polishing plate
- Porous expanded polyurethane surface, selected to retain abrasive efficiently during CMP
- Controlled pad density, specified at 0.60 g/cm³
- Controlled compressibility, with a dynamic compressibility of 9.3%
- High elastic recovery, with a stated elastic rebound of 93%
- Balanced pad hardness, specified at Shore A 85 and Shore D 32
- Suitable for hard materials, including sapphire, optical materials and ceramics
- Single-pad supply format, providing one polishing pad per order
Note: This is the plain EP2-P configuration intended for polishing surfaces smaller than 20 cm².
Benefits
- Maintains useful pad hardness and flatness while providing a compressible polishing surface.
- Recovers after compression to support consistent contact throughout the polishing process.
- Helps retain abrasive at the working surface for efficient CMP processing.
- Supports fast polishing while maintaining effective control of sample flatness.
- Provides the plain-pad configuration recommended for smaller polishing areas.
Why Choose the Logitech EP2 Plain Polyurethane Polishing Pad, 16 in (0CON-483)?
The Logitech EP2 Plain Polyurethane Polishing Pad, 16 in (0CON-483) combines a porous micro-cellular structure, controlled compressibility and pressure-sensitive adhesive backing for precision polishing of hard materials. John Morris Group supplies this exact Logitech CMP consumable for semiconductor, optical and advanced-material processing applications across Australia.
