24" Diameter Grooved Expanded Polyurethane Polishing Pad - 0.050" thick W/PSA backing with 10mm XY Grooving (Type 24EP2G) - each_1658583
Representative image only

Logitech EP2 Grooved Polyurethane Pad, 24 in, 10 mm XY

$3,825.80

The price is inclusive of GST

The Logitech EP2 Grooved Polyurethane Pad, 24 in, 10 mm XY (0CON-490) is a porous expanded polyurethane pad manufactured for chemical mechanical polishing of hard materials. This single 24 in (600 mm) EP2-G pad features a 1.3 mm thickness, 10 mm XY grooving and pressure-sensitive adhesive backing for the Logitech Orbis polishing system.

Key Features

  • 24 in (600 mm) pad diameter, sized for use with the Logitech Orbis polishing system
  • 10 mm XY grooved surface, supporting slurry distribution across larger polishing areas
  • Grooved EP2-G configuration, designed for polishing surfaces greater than 20 cm²
  • Micro-cellular EP2 structure, providing a sponge-like response while maintaining hardness and flatness
  • 1.3 mm pad thickness, equivalent to approximately 0.050 in
  • Pressure-sensitive adhesive backing, enabling secure attachment to a clean, smooth and flat base plate
  • Controlled pad density, specified at 0.59 g/cm³ in the technical data sheet
  • Balanced pad hardness, with a Shore A hardness range of 84–86 and Shore D hardness of 32
  • Controlled compressibility, with a stated dynamic compressibility of 9.3%
  • High elastic recovery, with a stated elastic rebound of 93%
  • Efficient abrasive retention, helping maintain polishing media at the pad surface during CMP
  • Broad hard-material suitability, including sapphire, silicon, semiconductor substrates, aluminium nitride, aluminium, PZT, optics, alexandrite rods and ceramics
  • Single-pad supply format, providing one replacement polishing pad per order

Note: Apply the pad to a clean, smooth and flat base plate, roll it on to minimise trapped air and condition the surface before processing. Use nitrile gloves during handling to reduce cross-contamination.

Benefits

  • Supports fast polishing while maintaining effective control of sample flatness.
  • Improves slurry movement across larger samples through the XY-grooved surface.
  • Recovers after compression to support stable and consistent polishing contact.
  • Helps produce high-quality surface finishes across suitable semiconductor, optical and ceramic materials.
  • Provides the verified pad size and configuration required for the Logitech Orbis system.

Why Choose the Logitech EP2 Grooved Polyurethane Pad, 24 in, 10 mm XY (0CON-490)?

The Logitech EP2 Grooved Polyurethane Pad, 24 in, 10 mm XY (0CON-490) combines a micro-cellular structure, controlled compressibility and grooved slurry distribution for precision CMP of larger hard-material surfaces. John Morris Group supplies this exact Logitech Orbis polishing pad for semiconductor, optical and advanced-material processing applications across Australia.

Over 40,000 Customers Trust John Morris