The Logitech EP2 Grooved Polyurethane Pad, 22 in, 10 mm XY (0CON-385) is a 22 in (550 mm) expanded polyurethane polishing pad manufactured for chemical mechanical polishing of hard materials. This single EP2-G pad features 10 mm XY grooving, a 0.050 in (approximately 1.3 mm) thickness and pressure-sensitive adhesive backing for installation on a compatible DP1 polishing plate.
Key Features
- 22 in (550 mm) pad diameter, sized for use with the Logitech DP1 polishing system
- 10 mm XY grooved surface, designed for polishing surfaces greater than 20 cm²
- Micro-cellular EP2 structure, providing a sponge-like response while maintaining hardness and flatness
- 0.050 in polishing thickness, specified as approximately 1.3 mm
- Pressure-sensitive adhesive backing, supporting secure attachment to a clean, smooth and flat base plate
- Controlled mechanical properties, with 0.59 g/cm³ density, 9.3% compressibility and 93% elastic rebound
- Shore A hardness of 84–86, providing a slightly softer alternative to the EP1 pad
- Suitable for hard materials, including sapphire, optical materials and ceramics
- Efficient abrasive retention, helping maintain abrasive at the polishing surface during CMP
- Single-pad supply format, allowing the required DP1 pad to be ordered individually
Note: Apply the pad to a clean, smooth and flat base plate, roll it on to minimise trapped air, and condition the surface before processing.
Benefits
- Supports fast polishing while maintaining effective control of sample flatness.
- Improves slurry movement across larger samples through the XY-grooved surface.
- Recovers after compression to support consistent contact during polishing.
- Helps produce high-quality surface finishes across suitable hard materials.
- Provides the verified size and configuration required for the Logitech DP1 system.
Why Choose the Logitech EP2 Grooved Polyurethane Pad, 22 in, 10 mm XY (0CON-385)?
The Logitech EP2 Grooved Polyurethane Pad, 22 in, 10 mm XY (0CON-385) combines a micro-cellular structure, controlled compressibility and grooved slurry distribution for CMP of larger hard-material surfaces. John Morris Group supplies this exact Logitech DP1 polishing pad for precision material-processing applications across Australia.
