The Logitech EP1 Grooved Polishing Pad, 22 in, 10 mm XY (0CON-370) is a porous expanded polyurethane CMP pad for precision polishing of hard materials. Supplied as a single 22 in / 550 mm EP1-G pad, it combines 10 mm XY grooving, pressure-sensitive adhesive backing and a controlled-cell foamed elastomer structure for stable polishing performance.
Key Features
- Large 22 in / 550 mm diameter, supplied as a single polishing pad for the Logitech DP1 system
- 10 mm XY grooved surface, supporting effective slurry distribution across larger polishing areas
- High-hardness EP1 construction, manufactured from porous expanded polyurethane for hard-material CMP processes
- Controlled-cell foamed elastomer structure, engineered to improve planarity during polishing
- Pressure-sensitive adhesive backing, supporting secure and stable mounting to a clean, smooth base plate
- High material hardness, with a Shore A hardness range of 95-97 and Shore D hardness of 46
- Controlled mechanical response, with 0.70 g/cm³ density, 7.5% compressibility and 93% elastic rebound
- Broad hard-material suitability, including silicon, sapphire, ceramics, optical substrates, CMP titanium, silicon carbide and alexandrite rods
- Efficient abrasive retention, helping maintain polishing action across demanding CMP processes
Benefits
- Improves surface planarity and finish consistency when polishing hard semiconductor, ceramic and optical materials.
- Supports efficient slurry movement across surfaces greater than 20 cm² through the grooved pad configuration.
- Reduces movement during processing through the pressure-sensitive adhesive mounting surface.
- Provides predictable pad response through controlled compressibility and high elastic rebound.
- Simplifies selection for DP1 users through its confirmed 22 in EP1-G configuration and single-pad pack size.
Why Choose the Logitech EP1 Grooved Polishing Pad, 22 in, 10 mm XY (0CON-370)?
The Logitech EP1 Grooved Polishing Pad, 22 in, 10 mm XY (0CON-370) combines high hardness, controlled compressibility and grooved slurry distribution for precision CMP of demanding hard materials. John Morris Group supplies this Logitech polishing consumable to Australian semiconductor, optics and advanced-material laboratories.
