The Logitech EP1 Grooved Polishing Pad, 16 in / 400 mm (0CON-482) is a single expanded polyurethane pad designed for chemical mechanical polishing of hard semiconductor, ceramic and optical materials. Its high-hardness, controlled-cell EP1 structure features 10 mm XY grooving and pressure-sensitive adhesive backing for slurry distribution and stable mounting.
Key Features
- Grooved 16 in / 400 mm pad configuration, supplied as one EP1-G polishing pad
- 10 mm XY groove pattern, helping distribute slurry across the polishing surface
- Controlled-cell EP1 structure, using a foamed elastomer construction developed for hard-material polishing
- High-hardness polishing surface, rated at Shore A 96 and Shore D 46
- Porous expanded polyurethane construction, with a verified density of 0.70 g/cm³
- Controlled mechanical response, with 7.5% dynamic compressibility and 93% elastic rebound
- Efficient abrasive retention, helping maintain polishing media at the working surface
- Pressure-sensitive adhesive backing, supporting secure application to a clean, smooth and flat base plate
- Suitable for demanding hard materials, including silicon, sapphire, ceramics and optical substrates
- Compatible with Logitech polishing systems, including the LP70, Akribis-Air and Tribo
Note: Logitech designates grooved pads for sample surfaces greater than 20 cm². The manufacturer page lists the pad thickness as 0.050 in in the product heading and 2.5 mm in its technical table; confirm the required thickness before ordering.
Benefits
- Helps improve slurry access and distribution when polishing larger sample surfaces.
- Supports strong planarity and consistent surface finishing on hard materials.
- Promotes repeatable polishing through defined compression and recovery characteristics.
- Helps use polishing abrasive efficiently by retaining it at the working surface.
- Simplifies pad fitting and replacement through the pressure-sensitive adhesive backing.
Why Choose the Logitech EP1 Grooved Polishing Pad, 16 in / 400 mm (0CON-482)?
The Logitech EP1 Grooved Polishing Pad, 16 in / 400 mm (0CON-482) combines a hard, controlled-cell polyurethane structure with 10 mm XY grooving for demanding CMP processes. Its defined density, compressibility and rebound characteristics support controlled polishing of silicon, sapphire, ceramics and optical substrates. John Morris Group supplies this verified Logitech EP1-G polishing consumable for Australian laboratories and materials-processing facilities.
