The Logitech Logipol CS60 Polishing Solution, 1 Gallon (0CON-511) is an opaque colloidal silica slurry with a 60 nm mean particle diameter and 50-60% amorphous silica content. Supplied in a 4.5 L bottle, it is designed for bulk polish removal and thin-film planarisation across semiconductor, optoelectronic and advanced-material processing applications.
Key Features
- Fine 60 nm mean particle diameter, providing a defined colloidal silica polishing medium
- High amorphous silica content, with a specified concentration of 50-60%
- Moderately alkaline formulation, with a pH range of 8.5-9.0
- Opaque ready-to-use slurry, supplied for use directly from the bottle
- One-gallon supply format, provided in a manufacturer-listed 4.5 L bottle
- Broad material suitability, including ceramic, silicon, sapphire, lithium niobate, YAG, PZT and fibre optic rods
- Suitable for III-V semiconductor materials, including indium phosphide and gallium arsenide
- Supports bulk polishing and planarisation, including bulk polish removal and thin-film planarisation
- Designed for use with Logitech polishing pads, supporting integrated Logitech polishing workflows
- Simple settling control, requiring mild daily agitation after first use
Benefits
- Reduces preparation steps because the polishing slurry is supplied ready to use.
- Supports multiple laboratory workflows with one solution suitable for semiconductor, optical and ceramic materials.
- Accommodates both bulk material removal and thin-film planarisation requirements.
- Simplifies process selection through clearly specified particle size, silica content, pH and density.
- Provides a practical 4.5 L supply volume for ongoing materials-processing work.
Why Choose the Logitech Logipol CS60 Polishing Solution, 1 Gallon (0CON-511)?
The Logitech Logipol CS60 combines a 60 nm colloidal silica medium with broad material compatibility and suitability for both bulk polishing and thin-film planarisation. John Morris Group supplies the exact 0CON-511 configuration for Australian semiconductor, optoelectronic and materials-processing laboratories.
