Chemcloth Polishing Cloth, 8" / 200mm diameter, pack of 10_1658786
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Logitech Chemcloth Polishing Cloth, 8 in / 200 mm, Pack 10

$1,756.70

The price is inclusive of GST

The Logitech Chemcloth Polishing Cloth, 8 in / 200 mm, Pack 10 (0CON-350) is a plain, textile-based polishing pad manufactured for chemical mechanical polishing processes. Each 1.5 mm thick pad features a black napped urethane surface and pressure-sensitive adhesive backing for bulk and final polishing of semiconductor, optical and other soft or hard materials.

Key Features

  • Plain 8 in / 200 mm pad format, providing the specified diameter for compatible polishing base plates
  • Manufactured specifically for CMP processes, supporting controlled chemical mechanical polishing workflows
  • Soft textile-based construction, suitable for polishing a range of soft and hard materials
  • Black napped urethane surface, integrated with the substrate to provide strong and durable nap performance
  • Vertically oriented pore structure, helping process slurry move through the compressible pad surface
  • Rapid recovery from compression, supported by 10-20% dynamic compressibility and 93% elastic rebound
  • Defined 0.25 mm dynamic deflection, providing a consistent mechanical response during polishing
  • 1.5 mm pad thickness, providing the verified profile for this Chemcloth variant
  • Efficient abrasive retention, helping maintain abrasive on the cloth surface during processing
  • Pressure-sensitive adhesive backing, enabling the pad to be applied to a clean, smooth and flat base plate
  • Broad material suitability, including III-V and II-VI semiconductors, silicon, sapphire, optics, silicon carbide and diamond
  • Pack of 10 polishing pads, supporting routine replacement and production requirements

Note: Logitech typically recommends a plain pad for samples under 2 in. For samples 2 in or larger, the pad should be grooved to improve slurry access and waste-slurry removal.

Benefits

  • Helps produce a high-quality surface finish and strong surface flatness through effective abrasive retention.
  • Supports both bulk and final polishing across materials ranging from soft semiconductors to hard substrates.
  • Promotes slurry movement through a compressible pore structure that recovers after loading.
  • Allows the plain pad to be conditioned or grooved according to the sample size and polishing application.
  • Simplifies mounting and pad replacement through pressure-sensitive adhesive backing and a ten-pad pack.

Why Choose the Logitech Chemcloth Polishing Cloth, 8 in / 200 mm, Pack 10 (0CON-350)?

The Logitech Chemcloth Polishing Cloth, 8 in / 200 mm, Pack 10 (0CON-350) combines a resilient textile and urethane pad structure with defined mechanical properties for CMP, bulk and final polishing. Its abrasive-retaining surface, compressible pore structure and adhesive backing make it a practical option for semiconductor, optical and advanced-material preparation. John Morris Group supplies this verified Logitech polishing consumable in packs of 10.

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