The Logitech B270 Glass Substrate, 207 mm, 8 mm, Pre-Lapped (0CON-339) is a higher-density glass carrier disc for temporarily supporting semiconductor and opto-electronic wafers during thinning and polishing. This variant has a 207 mm diameter, 8 mm thickness and pre-lapped parallel configuration for stable wafer processing and bonding applications.
Key Features
- 207 mm carrier diameter, identifying the exact size of this B270 substrate variant
- 8 mm substrate thickness, as specified on Logitech’s current product page
- Pre-lapped parallel configuration, supplied in the stated surface and alignment format
- Higher-density B270 glass construction, providing stability for larger wafer applications
- Temporary wafer support, designed to hold wafers during material preparation
- Semiconductor and opto-electronic compatibility, supporting both stated wafer categories
- Thinning and polishing applications, intended for use during these wafer preparation operations
- Stable during bonding, with higher-density glass designed not to distort during the bonding process
Benefits
- Maintains temporary support for delicate wafers during thinning and polishing workflows.
- Helps preserve process stability by resisting distortion during wafer bonding.
- Supports both semiconductor and opto-electronic wafer preparation with one carrier format.
- Makes product selection clearer through its defined diameter, thickness and pre-lapped parallel configuration.
Why Choose the Logitech B270 Glass Substrate, 207 mm, 8 mm, Pre-Lapped (0CON-339)?
The Logitech B270 Glass Substrate, 207 mm, 8 mm, Pre-Lapped (0CON-339) combines a higher-density glass carrier with a defined pre-lapped parallel configuration for temporary wafer support. John Morris Group supplies this Logitech consumable to Australian laboratories undertaking semiconductor and opto-electronic thinning, polishing and bonding operations.
