The Logitech B270 Glass Substrate, 105 mm, Unlapped (0CON-338) is a glass carrier disc for temporarily supporting semiconductor and opto-electronic wafers during thinning and polishing. This configuration combines a 105 mm diameter with an unlapped B270 glass surface.
Key Features
- 105 mm diameter, providing the specified disc size for compatible wafer preparation workflows
- Unlapped surface finish, supplied in the manufacturer-specified untreated configuration
- B270 glass construction, providing the higher-density glass format used for Logitech carrier substrates
- Temporary wafer support, designed to hold wafers during material preparation processes
- Suitable for semiconductor and opto-electronic wafers, supporting both types of wafer processing applications
- Designed for thinning and polishing operations, providing support through key material-removal stages
- Stable during bonding, with higher-density glass selected to resist distortion during the bonding process
- Single-disc pack, supplied as one B270 glass substrate
Benefits
- Helps maintain temporary wafer support during controlled thinning and polishing procedures.
- Provides an unlapped starting surface for workflows requiring this specific finish.
- Simplifies size selection by clearly identifying the 105 mm substrate configuration.
- Supports consistent bonding preparation through the stable B270 glass construction.
- Allows individual replacement or replenishment through the single-disc pack format.
Why Choose the Logitech B270 Glass Substrate, 105 mm, Unlapped (0CON-338)?
Choose the Logitech B270 Glass Substrate, 105 mm, Unlapped (0CON-338) when an exact 105 mm carrier disc with an unlapped finish is required for wafer thinning or polishing. John Morris Group supplies this verified Logitech configuration for semiconductor and opto-electronic preparation workflows in Australia.
