The Logitech B270 Glass Substrate, 105 mm, Pre-Lapped (0CON-337) is a B270 glass carrier disc for temporarily supporting semiconductor and opto-electronic wafers during thinning and polishing. Its 105 mm diameter and pre-lapped surface identify this variant for wafer-processing workflows requiring this size and finish.
Key Features
- 105 mm carrier diameter, providing the specified substrate size for compatible wafer-processing setups
- Pre-lapped surface, supplied with the surface preparation specified for this variant
- B270 glass construction, providing a higher-density glass carrier substrate
- Temporary wafer support, designed to hold wafers during material-processing operations
- Supports semiconductor wafers, for applicable thinning and polishing workflows
- Supports opto-electronic wafers, providing carrier support during precision processing
- Suitable for thinning and polishing, supporting key wafer-preparation stages
- Stable during bonding, with higher-density glass designed not to distort during the bonding process
- Single-substrate pack, supplied as one glass carrier substrate
Benefits
- Provides temporary support for delicate wafers throughout thinning and polishing operations.
- Supplies the specified 105 mm carrier size for straightforward variant selection.
- Provides a pre-lapped surface for processes requiring a prepared carrier substrate.
- Higher-density B270 glass supports carrier stability during the bonding process.
- Single-substrate packaging allows the required quantity to be ordered individually.
Why Choose the Logitech B270 Glass Substrate, 105 mm, Pre-Lapped (0CON-337)?
The Logitech B270 Glass Substrate, 105 mm, Pre-Lapped (0CON-337) combines temporary wafer support with a pre-lapped surface and stable higher-density glass construction. John Morris Group supplies this exact Logitech carrier substrate for semiconductor and opto-electronic material-processing applications across Australia.
