LP70G with Bluetooth Software precision Lapping & Polishing Machine, complete with 2 metered abrasive dispensing unit and 2 abrasive cylinders, eccentric sweep facility on four workstations  (220-240v / 50Hz)_1660288
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Logitech LP70G With Bluetooth Software Precision Lapping & Polishing Machine, Complete With 2 Metered Abrasive Dispensing Unit And 2 Abrasive Cylinders, Eccentric Sweep Facility On Four Workstations (220-240V / 50Hz)

The Logitech LP70G Multi-station Lapping & Polishing System is a precision-engineered solution designed to support high-throughput sample processing with unmatched repeatability. Featuring four independent workstations, Bluetooth-enabled control, and advanced abrasive delivery, the LP70G enhances lab productivity while ensuring consistent, high-quality results. It is ideal for laboratories and facilities working with wafers up to 100 mm.

Product Features

  • Four workstations, each with a wafer processing capacity of up to 100 mm (4″)
  • Bluetooth-enabled features including automatic plate flatness control
  • Real-time data collection and feedback from digital indicator on jigs for endpoint thickness control and increased accuracy
  • Metered abrasive feed delivery via peristaltic pumps, adjustable from 1 to 100 ml
  • Driven jig roller arm technology for enhanced accuracy and repeatability
  • Plate speeds adjustable between 5 and 100 rpm to suit different material types and processing stages
  • Includes 2 metered abrasive dispensing units and 2 abrasive cylinders
  • Eccentric sweep facility on all four workstations for uniform polishing
  • Operates on a 220-240 V / 50 Hz power supply

Benefits

  • Simultaneous multi-sample processing increases laboratory throughput
  • Bluetooth integration ensures precise automated control and monitoring
  • Customizable abrasive flow improves polishing quality and material removal rate
  • High repeatability through advanced jig roller technology
  • Efficient process tuning with wide range of plate speeds
  • Uniform sample finish ensured by eccentric sweep across all stations

Why Choose the Logitech LP70G?

The Logitech LP70G combines automation, accuracy, and advanced control in a multi-station lapping and polishing system. With four fully functional workstations, Bluetooth connectivity, and precision abrasive delivery, it is the ideal choice for laboratories demanding scalable, repeatable, and efficient sample processing. Whether in semiconductor, materials science, or R&D, the LP70G delivers high-performance results with ease.

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