LP70G with Bluetooth Software precision Lapping & Polishing Machine, complete with 2 metered abrasive dispensing unit and 2 abrasive cylinders, eccentric sweep facility on four workstations (220-240v / 50Hz)

LP70 Multi-station Lapping & Polishing System Key Features Four workstations each with a wafer process capacity of up to 100mm/4″ Bluetooth enabled features such as automatic plate flatness control and real time data collection and feedback from digital indicator on jigs for end point thickness control and increased accuracy Metered abrasive feed delivery via peristaltic pumps allowing users to set the flow rate between 1-100ml Driven jig roller arm technology greatly increases accuracy and repeatability Plate speeds of between 5 and 100rpm, facilitating faster lapping and polishing rates

LP70 Multi-station Lapping & Polishing System Key Features Four workstations each with a wafer process capacity of up to 100mm/4″ Bluetooth enabled features such as automatic plate flatness control and real time data collection and feedback from digital indicator on jigs for end point thickness control and increased accuracy Metered abrasive feed delivery via peristaltic pumps allowing users to set the flow rate between 1-100ml Driven jig roller arm technology greatly increases accuracy and repeatability Plate speeds of between 5 and 100rpm, facilitating faster lapping and polishing rates