Logitech SWC-3000_1680853
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Logitech SWC 3000 Automated Wafer Cleaning System

The Logitech SWC 3000 is a high-performance, automated wafer cleaning system designed for precision surface preparation in advanced semiconductor and materials science applications. Offering controlled chemical dispensing, megasonic cleaning, and in-situ drying, this compact system delivers superior particle removal and process repeatability. Ideal for post-CMP cleaning and a wide variety of wafer materials, the SWC 3000 is a cost-effective solution that meets modern cleanroom and laboratory needs.

Product Features

  • Automated wafer cleaning system with precise chemical dispensing capabilities
  • Designed for cleaning single wafers up to 300 mm (12″) in diameter
  • Supports cleaning of both patterned and unpatterned wafers including Germanium (Ge), Gallium Arsenide (GaAs), and Indium Phosphide (InP)
  • Suitable for post-CMP cleaning, diced chip cleaning on wafer frames, post plasma etch or photoresist stripping, mask blank and contact mask cleaning, and optic lens cleaning
  • Combines chemical dispensing with megasonic cleaning technology for highly optimized cleaning performance
  • Capable of in-situ spin drying using heated N2 or IPA for “Dry-In-Dry-Out” one-step processing
  • Typical cleaning process time ranges from 3 to 5 minutes depending on wafer size and configuration
  • Compact, floor-standing design ideal for laboratory and pilot-scale environments
  • User-friendly interface for parameter configuration and cycle control

Benefits

  • Delivers consistent and repeatable wafer cleaning results across a wide range of materials
  • Reduces particle contamination and boosts yield in post-process stages
  • Supports rapid process cycles with minimal operator involvement
  • Minimizes chemical usage and reduces overall cost of ownership
  • Compact design saves valuable lab or cleanroom space

Why Choose the Logitech SWC 3000?

The Logitech SWC 3000 combines precision chemical control, advanced cleaning technology, and user-friendly automation in one compact system. Engineered for cleaning wafers up to 300 mm, it delivers professional-grade cleaning suitable for post-CMP, etching, photolithography, and optical applications. The SWC 3000 enables “Dry-In-Dry-Out” processing with reduced footprint and cost, making it an excellent investment for research labs and production facilities alike.

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