The Logitech CMP Tribo Chemical Mechanical Polishing System is a state-of-the-art polishing solution designed for semiconductor and wafer processing. Featuring a PC-driven control system with an intuitive touchscreen interface, this system offers precise process control and efficient operation.
Product Features
- PC-driven control system for accurate process management
- Touchscreen interface for easy operation and monitoring
- Twin feed slurry delivery system ensuring consistent slurry supply
- Wafer carrier head with 4" (100 mm) diameter capacity
- Integrated pad conditioning tool to maintain pad performance
- Nanometer level material removal on individual die or wafers up to 100 mm / 4" diameter
- Suitable for a wide variety of wafer and substrate materials used in device fabrication
- Industry-standard control and layer removal for CMP with laser-quality surfaces (0/0 scratch dig)
- Achieves subnanometer Ra surface roughness on substrates
- Highly versatile with options for different carrier heads, polishing templates, wet bench modules, and end point detection
- Collects multiple sensor data variables for in-situ process monitoring
- Integrated real-time analytical software converts data into actionable information
- Data export capability compatible with Microsoft Excel and other standard packages
- Designed for chemical mechanical planarization (CMP) in semiconductor manufacturing
- Reliable and repeatable polishing for high-quality wafer surfaces
Applications
- Silicon Wafer CMP
- Global CMP of III-V Compound Semiconductors
- Global CMP of Silicon Nitride, Oxides & Polymer Layers
- Global CMP of brittle, friable IR material substrates
- Global CMP of Sapphire, Gallium Nitride & Silicon Carbide substrates
- Reclamation of EPI ready substrates
- Final stage thinning of SOS and SOI wafers to below 20 microns
- Device delayering for reverse engineering of FA applications
Benefits
- Improved process control through PC-based system and touchscreen interface
- Consistent slurry delivery improves polishing uniformity
- Pad conditioning prolongs pad life and maintains performance
- Supports wafers up to 4" diameter for versatile processing
- High reliability and repeatability for advanced semiconductor fabrication
- Advanced data analytics for optimized process control and quality assurance
- In process diamond conditioning
- Process both hard and soft materials
- Wide range of wafer sizes catered for
- High downward load settings available
- Back pressure settings for better process results
- End point detection available to monitor polishing in real time
Why Choose the Logitech CMP Tribo Polishing System?
This Logitech CMP Tribo Chemical Mechanical Polishing System offers precise, reliable polishing essential for semiconductor wafer production. Its advanced control system, slurry delivery, pad conditioning, and integrated real-time analytics ensure consistent high-quality results and operational efficiency.
