The Logitech Orbis CMP system is a precision engineered, floor standing CMP tool ideally suited for R&D environments.  Typically the Orbis CMP System is used in applications which conduct pilot production tests with optimum analytical capabilities and enhanced processing performance. The CMP Orbis is configured for polishing 6” and 4” wafers (but with the capability of upgrading to 8”) including end point detection. Orbis allows user to configure a wide range of parameters and process conditions via the touch screen interface including CoF, carried load and slurry delivery. On-board analytical sensors allow the operator concise real-time monitoring capabilities via the systems interface. Recipe mode allows users to build, save and re-call multi-stage recipes allowing for easy process repeatability - even across different operators. 

The system capabilities can be adapted to include:

• Back-end IC manufacturing,
• Micro-Electromechanical Systems (MEMS) fabrication,
• Opto-MEMS
• Bio-MEMS fabrication.

Key Features:

• Ideal for R&D environments and pilot process testing
• High capacity workspace for samples up to 2 of 200mm (8″)
• Downloadable data for analysis of process parameters
• Laboratory scale footprint
• Industry standard pad conditioning to maintain optimum pad life

Low cost solution – high value results

The ability to conduct pilot process tests normally requires expensive production level systems, yet the Orbis achieves this capability in a cost effective system. Incorporating enhanced features and high-tech functionality, the Orbis CMP System achieves superior processing capabilities to those usually offered in a system of this size.

Flexible use of operation

In addition to its ability to replicate production level environments, the Orbis is also suitable for more traditional R&D usage.  This includes small batch production and pilot production testing.  The system is capable of processing all die, wafer and part wafers up to 200mm (8″) diameter using a dedicated carrier. As with previous Logitech CMP equipment, templates and shims can be utilised or the samples can be mounted directly to the sample carriers.