The Logitech BJ6 Six-Position Zero Bonding Jig is designed for precise sample bonding, allowing materials to be fixed to substrates such as microscopic slides for thin and ultra-thin section production. This jig ensures controlled orientation for optimal sample thickness and parallelism.
Product Features
- Supports zero bonding and controlled thickness bonding techniques for precise orientation and thickness control
- Six-position design with two sets of three loading pistons on either side of the central line
- Two bonding stations equipped with a large section facility for bigger samples
- Includes six PTFE load spreaders with every jig
- Ideal for single workstation geological sample preparation systems
- Also suitable for bonding semiconductor wafers
- Ensures high precision in sample bonding and thickness control
Benefits
- Achieves optimal sample thickness and parallelism for consistent results
- Supports multiple bonding techniques for flexibility in sample preparation
- Robust and precise design suitable for laboratory or industrial applications
- Enhances efficiency in geological and semiconductor bonding workflows
Why Choose Logitech BJ6 Six-Position Zero Bonding Jig with Large Section Facility?
Logitech’s BJ6 jig provides a precise, reliable, and versatile solution for bonding samples, supporting high-quality thin and ultra-thin section preparation with controlled orientation and thickness.
