The Logitech High Speed Lapping & Polishing Machine with Vacuum Carrier Upgrade (1CM43-S-3111) is a high speed lapping and polishing system for hard material processing in production and research laboratories. The supplied description states that it is designed for materials such as diamond, gallium nitride, sapphire and silicon carbide, with real-time process monitoring and touch-panel control.
Key Features
- Brand: Logitech
- Model: High Speed Lapping and Polishing Machine
- Part Number: 1CM43-S-3111
- Product Type: High speed lapping and polishing machine
- Upgrade: Vacuum carrier upgrade, as stated in the product name
- Application: Processing and analysis of hard materials
- Suitable Materials: Diamond, gallium nitride, sapphire and silicon carbide
- Process Monitoring: Real-time in-situ sensor feedback
- Monitored Parameters: Coefficient of friction, pad temperature, slurry temperature, plate temperature and carrier/pad interface temperature
- Lapping Plate Diameter: 40 cm / 16 inch
- Polishing Plate Diameter: 400 mm / 16 inch
- Sample Capacity: Substrates, part wafers and full wafers up to 100 mm / 4 inch
- Jig Compatibility: Designed to work with Logitech Precision Lapping Jigs
- Carrier Function: Carrier can apply high downloads to increase polishing rate on harder materials
- Back Pressure Function: Head back pressure can be used to adjust sample shape
- Plate Changeover: Designed for quick and easy changeover of plates
- Pad Options: Multiple polishing pad options
- User Interface: Touch panel control
- Software: LabVIEW 10 analytical software technology
- Data Export: USB export to third-party statistical or analytical software
Note: This output is based on the supplied current description only because no public source was found that verified part number 1CM43-S-3111 as the exact high speed lapping and polishing machine with vacuum carrier upgrade configuration.
Benefits
- Supports hard material lapping and polishing in production and research environments.
- Real-time sensor feedback helps operators evaluate process stability and process conditions.
- Coefficient of friction and temperature monitoring support more informed polishing control.
- High carrier downloads support increased polishing rates on harder materials.
- USB data export helps users analyse process information in third-party software.
- Quick plate changeover and multiple pad options support flexible processing workflows.
Why Choose the Logitech High Speed Lapping & Polishing Machine with Vacuum Carrier Upgrade (1CM43-S-3111)?
The Logitech High Speed Lapping & Polishing Machine with Vacuum Carrier Upgrade provides a supplied configuration for high speed processing of hard materials with real-time monitoring, touch-panel control and USB data export. John Morris Group supplies Logitech lapping and polishing equipment for laboratory, research and production applications across Australia and New Zealand.
