Reactive-ion etching (RIE) is an etching technology used in micro & nano-fabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers and small substrates. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it.
Since SAMCO's establishment in 1979 they have developed a wealth of dry etching expertise. Today our product line includes Reactive Ion Etching (RIE), Inductively Coupled Plasma Etching (ICP with SAMCO proprietary "Tornado Coil Electrode", and Deep Reactive Ion Etching (DRIE) systems designed for the BOSCH process.
Different varieties of the above include: open-load, load-lock, and cassette type systems for both R&D and Mass Production applications